Kaygisiz, Y.Ocak, Y.Aksoz, S.Marasli, N.Keslioglu, K.Cadirli, E.Kaya, H.2019-08-012019-08-0120100009-26141873-4448https://dx.doi.org/10.1016/j.cplett.2009.11.043https://hdl.handle.net/11480/4922The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.eninfo:eu-repo/semantics/closedAccessArticle4844544721922410.1016/j.cplett.2009.11.0432-s2.0-72649100150Q2WOS:000273051800027Q2