Surme, YavuzGurten, A. AliBayol, EmelErsoy, Ersay2019-08-012019-08-0120090925-8388https://dx.doi.org/10.1016/j.jallcom.2009.05.150https://hdl.handle.net/11480/5003Copper-tin alloy films were galvanostatically electrodeposited on the mild steel (MS) by combining the different amount of Cu and Sri electrolytes at a constant temperature (55 degrees C) and pH (3.5). Alloy films were characterized by using the energy dispersive X-ray analysis (EDX), scanning electron microscopy (SEM), X-ray diffraction (XRD) and micrographing techniques. Corrosion behaviours were evaluated with electrochemical impedance spectrometry (EIS) and electrochemical polarization measurements Time gradient of electrolysis process was adjusted to obtain same thickness of investigated alloys on MS. The systematic corrosion investigation of various Cu(x)-Sn(100-x) (x = 0-100) alloy depositions on MS substrate were carried out in 0.1 M sulphuric acid medium. Results indicate that the corrosion resistance of the alloy coatings depended on the alloy composition, and the corrosion resistance increased at Cu-Sn alloy deposits in proportion to Sri ratio. (C) 2009 Elsevier B.V All rights reserved.eninfo:eu-repo/semantics/closedAccessCu-sn electrodepositionEnergy dispersive X-ray analysisCorrosionElectrochemical impedance spectroscopyArticle485453239810310.1016/j.jallcom.2009.05.1502-s2.0-72049089017Q1WOS:000271542900033Q1