Akbulut, S.Ocak, Y.Marasli, N.Keslioglu, K.Kaya, H.Cadirli, E.2019-08-012019-08-0120091044-58031873-4189https://dx.doi.org/10.1016/j.matchar.2008.08.010https://hdl.handle.net/11480/5088The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 degrees C. Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid Sn solution have been determined from the observed grain boundary groove shapes. The thermal conductivity of solid phase for In-21.23 at.% Bi-19.04 at.% Sn alloy and the thermal conductivity ratio of liquid phase to solid phase at the melting temperature have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2008 Elsevier Inc. All rights reserved.eninfo:eu-repo/semantics/closedAccessCrystal growthIn-Bi-Sn eutectic alloySurface energyGrain boundary energyThermal conductivityArticle60318319210.1016/j.matchar.2008.08.0102-s2.0-58649103769Q1WOS:000264252800004Q1