Kaygisiz, Y.Akbulut, S.Ocak, Y.Keslioglu, K.Marasli, N.Cadirli, E.Kaya, H.2019-08-012019-08-0120090925-8388https://dx.doi.org/10.1016/j.jallcom.2009.07.155https://hdl.handle.net/11480/4991The equilibrated grain boundary groove shapes of solid epsilon; (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid and solid epsilon (CuZn5) in equilibrium with solid Zn solution (Zn-2.83 at.% Cu) were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid have been determined to be (4.9 +/- 0.3) x 10(-8) K m, (76.0 +/- 9.1) x 10(-3) J m(-2) and (150.3 +/- 19.5) x 10(-3) J m(-2), respectively. For the first time, the equilibrated grain boundary groove shapes of solid epsilon (CuZn5) in equilibrium with solid Zn solution have been observed. The Gibbs-Thomson coefficient, solid-solid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with solid Zn have also been determined to be (4.7 +/- 0.3) x 10(-8) K m, (72.9 +/- 8.7) x 10(-3) J m(-2) and (144.1 +/- 18.7) x 10(-3) J m(-2), respectively from the observed grain boundary groove shapes. The thermal conductivities of solid Zn solution and solid epsilon; (CuZn5) phase (Zn-12 at.% Cu) have been measured with radial heat flow apparatus. The thermal conductivity ratios of the equilibrated liquid phase to solid phase for Zn-1.75 at.% Cu and Zn-12 at.% Cu alloys have also been measured with Bridgman type growth apparatus. (C) 2009 Elsevier B.V. All rights reserved.eninfo:eu-repo/semantics/closedAccessCrystal growthZn-Cu alloyInterfacial energyGrain boundary energyThermal conductivityArticle4874532310310810.1016/j.jallcom.2009.07.1552-s2.0-70350620282Q1WOS:000272521900027Q1