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    Experimental determination of solid-solid and solid-liquid interfacial energies of solid epsilon (CuZn5) in the Zn-Cu alloy
    (ELSEVIER SCIENCE SA, 2009) Kaygisiz, Y.; Akbulut, S.; Ocak, Y.; Keslioglu, K.; Marasli, N.; Cadirli, E.; Kaya, H.
    The equilibrated grain boundary groove shapes of solid epsilon; (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid and solid epsilon (CuZn5) in equilibrium with solid Zn solution (Zn-2.83 at.% Cu) were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid have been determined to be (4.9 +/- 0.3) x 10(-8) K m, (76.0 +/- 9.1) x 10(-3) J m(-2) and (150.3 +/- 19.5) x 10(-3) J m(-2), respectively. For the first time, the equilibrated grain boundary groove shapes of solid epsilon (CuZn5) in equilibrium with solid Zn solution have been observed. The Gibbs-Thomson coefficient, solid-solid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with solid Zn have also been determined to be (4.7 +/- 0.3) x 10(-8) K m, (72.9 +/- 8.7) x 10(-3) J m(-2) and (144.1 +/- 18.7) x 10(-3) J m(-2), respectively from the observed grain boundary groove shapes. The thermal conductivities of solid Zn solution and solid epsilon; (CuZn5) phase (Zn-12 at.% Cu) have been measured with radial heat flow apparatus. The thermal conductivity ratios of the equilibrated liquid phase to solid phase for Zn-1.75 at.% Cu and Zn-12 at.% Cu alloys have also been measured with Bridgman type growth apparatus. (C) 2009 Elsevier B.V. All rights reserved.
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    Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
    (ELSEVIER SCIENCE BV, 2010) Kaygisiz, Y.; Ocak, Y.; Aksoz, S.; Marasli, N.; Keslioglu, K.; Cadirli, E.; Kaya, H.
    The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.