Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder

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dc.authorid0000-0002-6830-8349
dc.contributor.authorCadirli, E.
dc.contributor.authorBoyuk, U.
dc.contributor.authorKaya, H.
dc.contributor.authorMarasli, N.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2012
dc.departmentNiğde ÖHÜ
dc.description.abstractSn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a wide range of temperature gradients (1.78-3.99 K/mm) using a Bridgman type directional solidification furnace. Wavelength-Dispersive X-ray Fluorescence spectrometry and X-ray diffraction were used to identify the compositions and phases in the microstructure. Dependence of eutectic spacings (lambda) on the growth rate (V), temperature gradient (G) and cooling rate (a(1a)) were determined using linear regression analysis. From the experimental results, it can be concluded that the values of lambda decrease with the increasing the values of V, G and a(1a). The value of lambda V-2 was determined using the measured values of lambda and V. The results obtained in the present work have been compared with previous results obtained for binary or ternary alloys.
dc.identifier.doi10.1007/s12540-012-2021-7
dc.identifier.endpage354
dc.identifier.issn1598-9623
dc.identifier.issue2
dc.identifier.scopus2-s2.0-84863812018
dc.identifier.scopusqualityQ1
dc.identifier.startpage349
dc.identifier.urihttps://dx.doi.org/10.1007/s12540-012-2021-7
dc.identifier.urihttps://hdl.handle.net/11480/4590
dc.identifier.volume18
dc.identifier.wosWOS:000303532600021
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherKOREAN INST METALS MATERIALS
dc.relation.ispartofMETALS AND MATERIALS INTERNATIONAL
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectalloys
dc.subjectsolidification
dc.subjectmicrostructure
dc.subjectsoldering
dc.subjectcrystal growth
dc.titleEffect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
dc.typeArticle

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