Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy

Basit Öğe Kaydı
dc.contributor.authorKaygisiz, Y.
dc.contributor.authorOcak, Y.
dc.contributor.authorAksoz, S.
dc.contributor.authorMarasli, N.
dc.contributor.authorKeslioglu, K.
dc.contributor.authorCadirli, E.
dc.contributor.authorKaya, H.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2010
dc.departmentNiğde ÖHÜ
dc.description.abstractThe equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [107T095]
dc.description.sponsorshipThis research was financially supported by the Scientific and Technical Research Council of Turkey (TUBITAK under Contract No: 107T095). Authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for their financial supports.
dc.identifier.doi10.1016/j.cplett.2009.11.043
dc.identifier.endpage224
dc.identifier.issn0009-2614
dc.identifier.issn1873-4448
dc.identifier.issue45447
dc.identifier.scopus2-s2.0-72649100150
dc.identifier.scopusqualityQ2
dc.identifier.startpage219
dc.identifier.urihttps://dx.doi.org/10.1016/j.cplett.2009.11.043
dc.identifier.urihttps://hdl.handle.net/11480/4922
dc.identifier.volume484
dc.identifier.wosWOS:000273051800027
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherELSEVIER SCIENCE BV
dc.relation.ispartofCHEMICAL PHYSICS LETTERS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleThermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
dc.typeArticle

Dosyalar

Koleksiyon

WoS İndeksli Yayınlar Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu