Directionally Solidified Al-Cu-Si-Fe Quaternary Eutectic Alloys
dc.authorid | Engin, Sevda/0000-0001-8746-8770 | |
dc.authorid | Buyuk, Ugur/0000-0002-6830-8349 | |
dc.contributor.author | Buyuk, U. | |
dc.contributor.author | Engin, S. | |
dc.contributor.author | Kaya, H. | |
dc.contributor.author | Cadirli, E. | |
dc.contributor.author | Marasli, N. | |
dc.date.accessioned | 2024-11-07T13:34:42Z | |
dc.date.available | 2024-11-07T13:34:42Z | |
dc.date.issued | 2020 | |
dc.department | Niğde Ömer Halisdemir Üniversitesi | |
dc.description.abstract | Directional solidification of eutectic alloys attracts considerable attention because of microhardness, tensile strength, and electrical resistivity affected by eutectic structures. In this research, solidification processing of Al-Cu-Si-Fe (Al-26 wt % Cu-6.5 wt % Si-0.5 wt % Fe) quaternary eutectic alloy by directional solidification is examined. The alloy was prepared by vacuum furnace and directionally solidified in Bridgman-type equipment. During the directional solidification process, the growth rates utilized varied from 8.25 to 164.80 mu m/s. The Al-Cu-Si-Fe system showed a eutectic transformation, which resulted in the matrix Al, lamellar Al2Cu, plate Si, and plate Al7Cu2Fe phases. The eutectic spacing lambda(Al2Cu) between lamellae of Al2Cu, as well as-lambda (Si), between plates of Si phase,-was measured. Additionally, the microhardness, tensile strength, and electrical resistivity of the studied alloy were determined using directionally solidified samples, and the experimental relationships between them were obtained. It was found that the microhardness, tensile strength, and electrical resistivity were affected by both eutectic spacing and the growth rate. | |
dc.description.sponsorship | Erciyes University [FBA-12-4016] | |
dc.description.sponsorship | This project was supported by Erciyes University Scientific Research Project Unit Contract no. FBA-12-4016. The authors are grateful to Erciyes University Scientific Research Project Unit for their financial support. | |
dc.identifier.doi | 10.1134/S0031918X20010044 | |
dc.identifier.endpage | 83 | |
dc.identifier.issn | 0031-918X | |
dc.identifier.issn | 1555-6190 | |
dc.identifier.issue | 1 | |
dc.identifier.scopus | 2-s2.0-85082382954 | |
dc.identifier.scopusquality | Q3 | |
dc.identifier.startpage | 78 | |
dc.identifier.uri | https://doi.org/10.1134/S0031918X20010044 | |
dc.identifier.uri | https://hdl.handle.net/11480/16132 | |
dc.identifier.volume | 121 | |
dc.identifier.wos | WOS:000519906100012 | |
dc.identifier.wosquality | Q4 | |
dc.indekslendigikaynak | Web of Science | |
dc.indekslendigikaynak | Scopus | |
dc.language.iso | en | |
dc.publisher | Maik Nauka/Interperiodica/Springer | |
dc.relation.ispartof | Physics of Metals and Metallography | |
dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | |
dc.rights | info:eu-repo/semantics/closedAccess | |
dc.snmz | KA_20241106 | |
dc.subject | quaternary Al-based alloy | |
dc.subject | microstructure | |
dc.subject | tensile strength | |
dc.subject | microhardness | |
dc.subject | electrical resistivity | |
dc.title | Directionally Solidified Al-Cu-Si-Fe Quaternary Eutectic Alloys | |
dc.type | Article |