Thermal Analysis of Chip on Board Packaging of High Power Led's with Heat Pipe Using Cfd for Street Lights
Küçük Resim Yok
Tarih
2018
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Gazi Univ
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
In this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined.
Açıklama
Anahtar Kelimeler
High power led, CFD, Heat pipe, Thermal analysis
Kaynak
Gazi University Journal of Science
WoS Q Değeri
N/A
Scopus Q Değeri
Cilt
31
Sayı
4
