Thermal Analysis of Chip on Board Packaging of High Power Led's with Heat Pipe Using Cfd for Street Lights
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Date
2018
Journal Title
Journal ISSN
Volume Title
Publisher
Gazi Univ
Access Rights
info:eu-repo/semantics/closedAccess
Abstract
In this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined.
Description
Keywords
High power led, CFD, Heat pipe, Thermal analysis
Journal or Series
Gazi University Journal of Science
WoS Q Value
N/A
Scopus Q Value
Volume
31
Issue
4
