Investigation of the Some Physical Properties of the Directionally Solidified Al-Cu-Co Ternary Eutectic Alloy
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Date
2015
Journal Title
Journal ISSN
Volume Title
Publisher
SPRINGER INDIA
Access Rights
info:eu-repo/semantics/closedAccess
Abstract
The Al-23.9% Cu-1.2% Co (wt%) ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth velocity (18.8 mu m/s) under different temperature gradients (1.23-5.66 K/mm) and at a constant temperature gradient (5.66 K/mm) under different growth velocities (8.3-166 mu m/s) in a Bridgman-type directional solidification furnace. The dependence of the eutectic spacing on the solidification parameters (temperature gradient and growth rate) and that of the microhardness and compressive strength on the eutectic spacing and solidification parameters were investigated. The electrical resistivity measurements of the studied alloy were performed and the temperature coefficient of the resistivity was calculated from the curve of the resulting rho-Icurrency sign plot. The thermal conductivities of the sample grown at a constant temperature gradient and growth rate were obtained using the Wiedemann-Franz and Smith-Palmer equations.
Description
Keywords
Directional solidification, Ternary eutectic alloy, Microhardness, Compressive strength, Electrical resistivity, Thermal conductivity
Journal or Series
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS
WoS Q Value
Q3
Scopus Q Value
Q2
Volume
68
Issue
5
