Investigation of the microhardness and the electrical resistivity of undercooled Ni-10 at.% Si alloys

Küçük Resim Yok

Tarih

2011

Dergi Başlığı

Dergi ISSN

Cilt Başlığı

Yayıncı

ELSEVIER SCIENCE BV

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Özet

Ni-10 at.% Si alloys (Ni and Si of purity of 99.99%) were prepared by arc melting method under argon atmosphere in a water-cooled copper hearth with a non-consumable tungsten electrode and titanium getter. Spherical-shaped Ni-10 at.% Si alloy melts are undercooled in a containerless electromagnetic levitation apparatus. The effects of undercooling (Delta T) on the microstructure, electrical resistivity (rho) and microhardness (HV) were investigated. The experimental results reveal that with the increase of the undercooling of the melts from 16 to 110 K, the microstructures undergo transition from coarse dendritic morphology to ultra fine dendritic morphology. The measurements of microhardness of the samples were performed by using a microhardness test device. The dependence of microhardness on undercooling was analyzed and it has been found that with increasing the undercooling the HV increases. Variations of electrical resistivity of the Ni10 at.% Si alloy with the temperature in the range of 300-800 K were also determined by using a standard d.c. four-point probe technique. The resistivity of samples increases with increasing temperature and undercooling. (C) 2010 Elsevier By. All rights reserved.

Açıklama

Anahtar Kelimeler

Undercooling, Microstructure, Microhardness, Electrical resistivity

Kaynak

JOURNAL OF NON-CRYSTALLINE SOLIDS

WoS Q Değeri

Q1

Scopus Q Değeri

Q2

Cilt

357

Sayı

3

Künye