Investigation of the microhardness and the electrical resistivity of undercooled Ni-10 at.% Si alloys
Küçük Resim Yok
Tarih
2011
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
ELSEVIER SCIENCE BV
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Ni-10 at.% Si alloys (Ni and Si of purity of 99.99%) were prepared by arc melting method under argon atmosphere in a water-cooled copper hearth with a non-consumable tungsten electrode and titanium getter. Spherical-shaped Ni-10 at.% Si alloy melts are undercooled in a containerless electromagnetic levitation apparatus. The effects of undercooling (Delta T) on the microstructure, electrical resistivity (rho) and microhardness (HV) were investigated. The experimental results reveal that with the increase of the undercooling of the melts from 16 to 110 K, the microstructures undergo transition from coarse dendritic morphology to ultra fine dendritic morphology. The measurements of microhardness of the samples were performed by using a microhardness test device. The dependence of microhardness on undercooling was analyzed and it has been found that with increasing the undercooling the HV increases. Variations of electrical resistivity of the Ni10 at.% Si alloy with the temperature in the range of 300-800 K were also determined by using a standard d.c. four-point probe technique. The resistivity of samples increases with increasing temperature and undercooling. (C) 2010 Elsevier By. All rights reserved.
Açıklama
Anahtar Kelimeler
Undercooling, Microstructure, Microhardness, Electrical resistivity
Kaynak
JOURNAL OF NON-CRYSTALLINE SOLIDS
WoS Q Değeri
Q1
Scopus Q Değeri
Q2
Cilt
357
Sayı
3
