Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy

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dc.authorid0000-0001-8746-8770
dc.authorid0000-0002-6830-8349
dc.contributor.authorCadirli, E.
dc.contributor.authorBoyuk, U.
dc.contributor.authorEngin, S.
dc.contributor.authorKaya, H.
dc.contributor.authorMarasli, N.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2009
dc.departmentNiğde ÖHÜ
dc.description.abstractSn-1.2wt.%Cu eutectic alloy was directionally solidified upward with different growth rates (2-78-136.36 mu m s(-1)) at a constant temperature gradient (2.69 K mm(-1)) and with different temperature gradients (2.69-8.88 K mm(-1)) at a constant growth rate (6.80 mu m s(-1)) in the Bridgman-type growth apparatus. The measurements of microhardness of directionally solidified samples were obtained by using a microhardness test device. The dependence of microhardness HV on the growth rate (V) and temperature gradient (G) were analysed. According to these results, it has been found that with the increasing values of V and G, the values of HV increase. Variations of electrical resistivity (p) and electrical conductivity (a) for Sn-1.2wt.%Cu cast alloy with the temperature in the range of 300-500 K were also measured by using a standard d.c. four-point probe technique. The variation of Lorenz coefficient with the temperature for Sn-1.2wt.%Cu eutectic alloy was determined by using the measured values of electrical conductivity and thermal conductivity. The enthalpy of fusion for the same alloy was determined by means of differential scanning calorimeter (DSC) from heating trace during the transformation from eutectic liquid to eutectic solid.
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [107T095]
dc.description.sponsorshipThe authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for financial support under contract no. 107T095.
dc.identifier.endpage387
dc.identifier.issn0023-432X
dc.identifier.issn1338-4252
dc.identifier.issue6
dc.identifier.scopus2-s2.0-75149167886
dc.identifier.scopusqualityQ3
dc.identifier.startpage381
dc.identifier.urihttps://hdl.handle.net/11480/5149
dc.identifier.volume47
dc.identifier.wosWOS:000273189500005
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherREDAKCIA KOVOVE MATERIALY
dc.relation.ispartofKOVOVE MATERIALY-METALLIC MATERIALS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjecteutectic solidification
dc.subjectsoldering
dc.subjecthardness
dc.subjectelectrical resistivity/conductivity
dc.titleVariations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy
dc.typeArticle

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