Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy

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dc.authorid0000-0002-6830-8349
dc.authorid0000-0001-8746-8770
dc.contributor.authorCadirli, E.
dc.contributor.authorBoyuk, U.
dc.contributor.authorEngin, S.
dc.contributor.authorKaya, H.
dc.contributor.authorMarasli, N.
dc.contributor.authorKeslioglu, K.
dc.contributor.authorUlgen, A.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2010
dc.departmentNiğde ÖHÜ
dc.description.abstractSn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 K/mm) at a constant growth rate (V = 7.64 mu m/s) and with different growth rates (V = 2.24-133.33 mu m/s) at a constant temperature gradient (G = 4.24 K/mm) by using a Bridgman type directional solidification apparatus. The microstructure of directional solidified Sn-3 wt% Cu alloy seems to be rod eutectic structure. The influence of the growth rate (V) and temperature gradient (G) on the rod spacing (lambda) and undercooling (Delta T) were analysed. The values of lambda(2)V, lambda(2)G, Delta T lambda, Delta TV(-0.5) and Delta TG(-0.5) were determined by using the Jackson-Hunt eutectic theory. The dependence of microhardness (HV) on the rod spacing (lambda) was analyzed. According to present results, it has been found that the value of HV increases with the increasing the value of lambda.
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [107T095]
dc.description.sponsorshipThis research was supported financially by the Scientific and Technical Research Council of Turkey (TUBITAK) under contract no. 107T095. The authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for their financial supports.
dc.identifier.doi10.1007/s10854-009-9965-5
dc.identifier.endpage618
dc.identifier.issn0957-4522
dc.identifier.issue6
dc.identifier.scopus2-s2.0-77955579181
dc.identifier.scopusqualityQ2
dc.identifier.startpage608
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-009-9965-5
dc.identifier.urihttps://hdl.handle.net/11480/4876
dc.identifier.volume21
dc.identifier.wosWOS:000277415100013
dc.identifier.wosqualityQ3
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleInvestigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
dc.typeArticle

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