Experimental determination of solid-solid and solid-liquid interfacial energies of solid epsilon (CuZn5) in the Zn-Cu alloy

dc.contributor.authorKaygisiz, Y.
dc.contributor.authorAkbulut, S.
dc.contributor.authorOcak, Y.
dc.contributor.authorKeslioglu, K.
dc.contributor.authorMarasli, N.
dc.contributor.authorCadirli, E.
dc.contributor.authorKaya, H.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2009
dc.departmentNiğde ÖHÜ
dc.description.abstractThe equilibrated grain boundary groove shapes of solid epsilon; (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid and solid epsilon (CuZn5) in equilibrium with solid Zn solution (Zn-2.83 at.% Cu) were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid have been determined to be (4.9 +/- 0.3) x 10(-8) K m, (76.0 +/- 9.1) x 10(-3) J m(-2) and (150.3 +/- 19.5) x 10(-3) J m(-2), respectively. For the first time, the equilibrated grain boundary groove shapes of solid epsilon (CuZn5) in equilibrium with solid Zn solution have been observed. The Gibbs-Thomson coefficient, solid-solid interfacial energy and grain boundary energy of solid epsilon (CuZn5) in equilibrium with solid Zn have also been determined to be (4.7 +/- 0.3) x 10(-8) K m, (72.9 +/- 8.7) x 10(-3) J m(-2) and (144.1 +/- 18.7) x 10(-3) J m(-2), respectively from the observed grain boundary groove shapes. The thermal conductivities of solid Zn solution and solid epsilon; (CuZn5) phase (Zn-12 at.% Cu) have been measured with radial heat flow apparatus. The thermal conductivity ratios of the equilibrated liquid phase to solid phase for Zn-1.75 at.% Cu and Zn-12 at.% Cu alloys have also been measured with Bridgman type growth apparatus. (C) 2009 Elsevier B.V. All rights reserved.
dc.description.sponsorshipScientific and Technical Research Council of Turkey [107T095]; Scientific and Technical Research Council of Turkey (TUBITAK)
dc.description.sponsorshipThis research was financially supported by the Scientific and Technical Research Council of Turkey (TUBITAK under Contract No: 107T095). Authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for their financial supports.
dc.identifier.doi10.1016/j.jallcom.2009.07.155
dc.identifier.endpage108
dc.identifier.issn0925-8388
dc.identifier.issue45323
dc.identifier.scopus2-s2.0-70350620282
dc.identifier.scopusqualityQ1
dc.identifier.startpage103
dc.identifier.urihttps://dx.doi.org/10.1016/j.jallcom.2009.07.155
dc.identifier.urihttps://hdl.handle.net/11480/4991
dc.identifier.volume487
dc.identifier.wosWOS:000272521900027
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherELSEVIER SCIENCE SA
dc.relation.ispartofJOURNAL OF ALLOYS AND COMPOUNDS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectCrystal growth
dc.subjectZn-Cu alloy
dc.subjectInterfacial energy
dc.subjectGrain boundary energy
dc.subjectThermal conductivity
dc.titleExperimental determination of solid-solid and solid-liquid interfacial energies of solid epsilon (CuZn5) in the Zn-Cu alloy
dc.typeArticle

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