Thermal buffering effect of a packaging design with microencapsulated phase change material

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dc.authoridunal, murat/0000-0003-0366-0816
dc.authoridKonuklu, Yeliz/0000-0002-6788-3114
dc.authoridPaksoy, Halime O./0000-0003-3200-8595
dc.contributor.authorUnal, Murat
dc.contributor.authorKonuklu, Yeliz
dc.contributor.authorPaksoy, Halime
dc.date.accessioned2024-11-07T13:25:28Z
dc.date.available2024-11-07T13:25:28Z
dc.date.issued2019
dc.departmentNiğde Ömer Halisdemir Üniversitesi
dc.description.abstractTemperature fluctuations during storage and transportation are the most important factors affecting quality and shelf life of food products. Phase change materials (PCM) with their isothermal characteristics are used to control temperature in various thermal operations. In this study, octanoic acid as PCM candidate was used in a packaging material design for thermal control of a food product. The PCM candidate was microencapsulated in different shell materials in our laboratory. Among the synthesized microcapsules, microencapsulated PCM (mPCM) (Delta Hm = 42.9 J/g) with styrene polymer as the shell material was selected based on its properties of being cost effective and compatibility with human health. Thermal buffering effect of PCM in bulk and microencapsulated forms was tested in a packaging design with special PCM pockets. Results showed that packages with mPCM and bulk PCM provided 8.8 and 6 hours of thermal buffering effect for 160 g of chocolate compared with the package without PCM (reference package).
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [TUBITAK 111M614]
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK), Grant/Award Number: TUBITAK 111M614
dc.identifier.doi10.1002/er.4578
dc.identifier.endpage4505
dc.identifier.issn0363-907X
dc.identifier.issn1099-114X
dc.identifier.issue9
dc.identifier.scopus2-s2.0-85066482151
dc.identifier.scopusqualityQ1
dc.identifier.startpage4495
dc.identifier.urihttps://doi.org/10.1002/er.4578
dc.identifier.urihttps://hdl.handle.net/11480/14732
dc.identifier.volume43
dc.identifier.wosWOS:000476956400037
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherWiley
dc.relation.ispartofInternational Journal of Energy Research
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/openAccess
dc.snmzKA_20241106
dc.subjectfood packing
dc.subjectmicroencapsulation
dc.subjectphase change material (PCM)
dc.subjectthermal energy storage
dc.titleThermal buffering effect of a packaging design with microencapsulated phase change material
dc.typeArticle

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