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    Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
    (SPRINGER, 2011) Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Aksoz, S.; Ocak, Y.
    Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (sigma) conductivity for the same alloys.
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    Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
    (ELSEVIER SCIENCE INC, 2010) Aksoz, S.; Ocak, Y.; Marasli, N.; Cadirli, E.; Kaya, H.; Boyuk, U.
    The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus temperature for the same alloys were determined from the Wiedemann-Franz and Smith-Palmer equations by using the measured values of thermal conductivity. From the graphs of thermal and electrical conductivity versus temperature, the thermal conductivity of the solid phases at their melting temperatures, and the thermal temperature and the electrical coefficients for the same alloys were obtained. Dependency of the thermal and electrical conductivity on the composition of Cu in the Al based Al-Cu alloys were also investigated. According to present experimental results, the thermal and electrical conductivity of Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys linearly decrease with increasing the temperature and composition of Cu. The enthalpy of fusion and the specific heat change during the transformation for the same alloys were determined from cooling trace during the transformation from eutectic liquid to eutectic solid by means of differential scanning calorimeter (DSC). (c) 2010 Elsevier Inc. All rights reserved.
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    Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
    (KOREAN INST METALS MATERIALS, 2010) Keslioglu, K.; Ocak, Y.; Aksoz, S.; Marasli, N.; Cadirli, E.; Kaya, H.
    The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy, and grain boundary energy of the solid Al solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Al-16.42 at.% Ag-4.97 at.% Cu and Al-16.57 at.% Ag-11.87 at.% Cu alloys and the thermal conductivity ratio of the liquid phase to the solid phase for Al-16.57 at.% Ag-11.87 at.% Cu alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.
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    Interfacial energies of solid CuAl2 in the CuAl2-Ag2Al pseudo binary alloy
    (ELSEVIER SCIENCE SA, 2010) Ocak, Y.; Aksoz, S.; Keslioglu, K.; Marasli, N.; Cadirli, E.; Kaya, H.
    Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy are important parameters for people doing comparisons between experimentally observed solidification morphology and predictions from theoretical models. Thus the Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid CuAl2 in the CuAl2-Ag2Al pseudo binary system have been determined from observed grain boundary groove shapes. The variation of thermal conductivity of solid CuAl2 with temperature has also been measured by using a radial heat flow apparatus. (C) 2010 Elsevier By. All rights reserved.
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    Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
    (ELSEVIER SCIENCE BV, 2010) Kaygisiz, Y.; Ocak, Y.; Aksoz, S.; Marasli, N.; Keslioglu, K.; Cadirli, E.; Kaya, H.
    The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.