Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Küçük Resim Yok

Tarih

2011

Dergi Başlığı

Dergi ISSN

Cilt Başlığı

Yayıncı

SPRINGER

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Özet

Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (sigma) conductivity for the same alloys.

Açıklama

Anahtar Kelimeler

Metals and alloys, crystal growth, electrical resistivity, thermal conductivity

Kaynak

JOURNAL OF ELECTRONIC MATERIALS

WoS Q Değeri

Q2

Scopus Q Değeri

Q3

Cilt

40

Sayı

2

Künye