Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

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dc.authorid0000-0002-6830-8349
dc.contributor.authorCadirli, E.
dc.contributor.authorBoyuk, U.
dc.contributor.authorKaya, H.
dc.contributor.authorMarasli, N.
dc.contributor.authorAksoz, S.
dc.contributor.authorOcak, Y.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2011
dc.departmentNiğde ÖHÜ
dc.description.abstractPb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (sigma) conductivity for the same alloys.
dc.description.sponsorshipNigde University Scientific Research Project Unit [FEB 2008/12]
dc.description.sponsorshipThis project was supported by Nigde University Scientific Research Project Unit under Contract No. FEB 2008/12. The authors are grateful to Nigde University Scientific Research Project Unit for their financial support.
dc.identifier.doi10.1007/s11664-010-1425-8
dc.identifier.endpage200
dc.identifier.issn0361-5235
dc.identifier.issn1543-186X
dc.identifier.issue2
dc.identifier.scopus2-s2.0-79951516057
dc.identifier.scopusqualityQ3
dc.identifier.startpage195
dc.identifier.urihttps://dx.doi.org/10.1007/s11664-010-1425-8
dc.identifier.urihttps://hdl.handle.net/11480/4753
dc.identifier.volume40
dc.identifier.wosWOS:000287861900012
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF ELECTRONIC MATERIALS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectMetals and alloys
dc.subjectcrystal growth
dc.subjectelectrical resistivity
dc.subjectthermal conductivity
dc.titleDependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
dc.typeArticle

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