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    Thermal Analysis of Chip on Board Packaging of High Power Led's with Heat Pipe Using Cfd for Street Lights
    (Gazi Univ, 2018) Cicek, Burcu; Sahin, Necmettin; Alkan, Mahmut
    In this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined.
  • Küçük Resim Yok
    Öğe
    Thermal analysis of chip on board packaging of high power led’s with heat pipe using Cfd for street lights
    (Gazi Universitesi, 2018) Cicek, Burcu; Sahin, Necmettin; Alkan, Mahmut
    In this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined. © 2018, Gazi University Eti Mahallesi. All rights reserved.