Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders

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dc.contributor.authorCadirli, E.
dc.contributor.authorKaya, H.
dc.contributor.authorSahin, M.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2011
dc.departmentNiğde ÖHÜ
dc.description.abstractPb100-x-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates (T) over dot (0.016 K s(-1) to 4.0 K s(-1)) by using a Bridgman-type directional solidification furnace. Microstructure parameters (primary dendrite arm spacing, lambda(1), and eutectic spacing, lambda(E)) and mechanical properties (microhardness, HV, and ultimate tensile strength, sigma) of the Pb100-x-Sn-x alloys were measured. The dependences of the microhardness and ultimate tensile strength on the cooling rate, microstructure parameters, and composition were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing cooling rate and Sn content, but decrease with increasing microstructure parameters.
dc.description.sponsorshipNigde University Scientific Research Project Unit [FEB 2009/02]
dc.description.sponsorshipThis project was supported by the Nigde University Scientific Research Project Unit under Contract No. FEB 2009/02. The authors thank Prof. Fahrettin Ozturk and Emre Esener, for their continuous support and laboratory facilities.
dc.identifier.doi10.1007/s11664-011-1668-z
dc.identifier.endpage1911
dc.identifier.issn0361-5235
dc.identifier.issue9
dc.identifier.scopus2-s2.0-80051598557
dc.identifier.scopusqualityQ3
dc.identifier.startpage1903
dc.identifier.urihttps://dx.doi.org/10.1007/s11664-011-1668-z
dc.identifier.urihttps://hdl.handle.net/11480/4698
dc.identifier.volume40
dc.identifier.wosWOS:000294070000005
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF ELECTRONIC MATERIALS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectDendritic growth
dc.subjecteutectic microstructure
dc.subjectmicrohardness
dc.subjecttensile strength
dc.titleEffects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders
dc.typeArticle

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