The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
Küçük Resim Yok
Tarih
2009
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
ELSEVIER SCIENCE SA
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a Bridgman type directional solidification furnace. The lamellar spacings (lambda) and microhardness values (H-V) were measured from both transverse and longitudinal sections of the samples. The dependence of lamellar spacings (lambda) and microhardness (H-V) on the growth rate (V) was determined by using linear regression analysis. According to these results, it has been found that the value of lambda decreases with the increasing value of V and whereas, the value of H-V increases for a constant G. The values of lambda V-2 were determined by using the measured values of lambda and V. The results obtained in this work have been compared with the previous similar experimental results obtained for binary or ternary alloys. (C) 2008 Elsevier B.V. All rights reserved.
Açıklama
Anahtar Kelimeler
Intermetallics, Metals, Crystal growth, Directional solidification, Ternary alloy
Kaynak
JOURNAL OF ALLOYS AND COMPOUNDS
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
470
Sayı
45323
