Determination of interfacial energies of solid Sn solution in the In-Bi-Sn ternary alloy
Küçük Resim Yok
Tarih
2009
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
ELSEVIER SCIENCE INC
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 degrees C. Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid Sn solution have been determined from the observed grain boundary groove shapes. The thermal conductivity of solid phase for In-21.23 at.% Bi-19.04 at.% Sn alloy and the thermal conductivity ratio of liquid phase to solid phase at the melting temperature have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2008 Elsevier Inc. All rights reserved.
Açıklama
Anahtar Kelimeler
Crystal growth, In-Bi-Sn eutectic alloy, Surface energy, Grain boundary energy, Thermal conductivity
Kaynak
MATERIALS CHARACTERIZATION
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
60
Sayı
3
