Determination of interfacial energies of solid Sn solution in the In-Bi-Sn ternary alloy

Küçük Resim Yok

Tarih

2009

Dergi Başlığı

Dergi ISSN

Cilt Başlığı

Yayıncı

ELSEVIER SCIENCE INC

Erişim Hakkı

info:eu-repo/semantics/closedAccess

Özet

The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 degrees C. Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid Sn solution have been determined from the observed grain boundary groove shapes. The thermal conductivity of solid phase for In-21.23 at.% Bi-19.04 at.% Sn alloy and the thermal conductivity ratio of liquid phase to solid phase at the melting temperature have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2008 Elsevier Inc. All rights reserved.

Açıklama

Anahtar Kelimeler

Crystal growth, In-Bi-Sn eutectic alloy, Surface energy, Grain boundary energy, Thermal conductivity

Kaynak

MATERIALS CHARACTERIZATION

WoS Q Değeri

Q1

Scopus Q Değeri

Q1

Cilt

60

Sayı

3

Künye