Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder
Küçük Resim Yok
Tarih
2012
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
SPRINGER
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The Sn-3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) at different temperature gradients (G = 1.43-4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3-500 mu m/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, lambda (L) and transverse section, lambda (T) ) and mechanical properties (microhardness, HV and ultimate tensile strength, sigma (UTS) ) of Sn-3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing.
Açıklama
Anahtar Kelimeler
Kaynak
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
WoS Q Değeri
Q2
Scopus Q Değeri
Q2
Cilt
23
Sayı
1
