Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

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dc.contributor.authorCadirli, E.
dc.contributor.authorSahin, M.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2012
dc.departmentNiğde ÖHÜ
dc.description.abstractThe Sn-3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) at different temperature gradients (G = 1.43-4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3-500 mu m/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, lambda (L) and transverse section, lambda (T) ) and mechanical properties (microhardness, HV and ultimate tensile strength, sigma (UTS) ) of Sn-3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing.
dc.description.sponsorshipNigde University [FEB 2009/02]
dc.description.sponsorshipThis project was supported by the Nigde University Scientific Research Project Unit under Contract No: FEB 2009/02. The authors thank Prof. Fahrettin Ozturk and Emre Esener, for their continuous support and laboratory facilities.
dc.identifier.doi10.1007/s10854-011-0398-6
dc.identifier.endpage40
dc.identifier.issn0957-4522
dc.identifier.issue1
dc.identifier.scopus2-s2.0-84856951553
dc.identifier.scopusqualityQ2
dc.identifier.startpage31
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-011-0398-6
dc.identifier.urihttps://hdl.handle.net/11480/4650
dc.identifier.volume23
dc.identifier.wosWOS:000298970300006
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleInfluence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder
dc.typeArticle

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