Multi-Layer I-Slot Microstrip Antenna for Internet of Things Applications
Küçük Resim Yok
Tarih
2023
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Institute of Electrical and Electronics Engineers Inc.
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
In this study, an antenna design is presented for the Internet of things applications that need directional antennas. The antenna design includes a multilayer I-slot microstrip patch antenna and two copper director rod elements. The multilayer I-slot microstrip patch antenna comprises three different layers. The first and third layers are FR4 materials with a dielectric constant of ?1 = 4.15 and a height of h = 1.6 mm while the second layer consists of PETG material with a dielectric constant of ?2 = 2.62 and a height of h = 4 mm. The copper rods utilized in our design are used to increase the directivity of the antenna and have a diameter of R = 2.7 mm. PETG material used in the antenna design is produced with a 3D printer. The simulations of the designed antenna in this study are carried out by using Comsol Multiphysics software. The proposed antenna produced after the design and the simulation studies. The simulation and measurement results are compared and found compatible. The antenna designed in this study for 2400-2483.5 MHz ISM band applications has a gain of 7.2 dBi and a bandwidth from 2398 MHz to 2554 MHz. © 2023 IEEE.
Açıklama
14th International Conference on Electrical and Electronics Engineering, ELECO 2023 -- 30 November 2023 through 2 December 2023 -- Virtual, Bursa -- 197135
Anahtar Kelimeler
3D printing, Copper, Dielectric materials, Internet of things, Microstrip antennas, Slot antennas, Antenna design, Comsol multiphysics, Copper rod, Different layers, Directional Antenna, Micro-strip patch antennas, Microstrip-patch antenna, Multi-layers, Multiphysics software, Second layer, Multilayers
Kaynak
14th International Conference on Electrical and Electronics Engineering, ELECO 2023 - Proceedings
WoS Q Değeri
Scopus Q Değeri
N/A
