Multi-Layer I-Slot Microstrip Antenna for Internet of Things Applications

dc.contributor.authorOner, Gulden Gunay Bulut
dc.contributor.authorBasbug, Suad
dc.contributor.authorAltuncu, Yasemin
dc.date.accessioned2024-11-07T10:39:26Z
dc.date.available2024-11-07T10:39:26Z
dc.date.issued2023
dc.departmentNiğde Ömer Halisdemir Üniversitesi
dc.description14th International Conference on Electrical and Electronics Engineering, ELECO 2023 -- 30 November 2023 through 2 December 2023 -- Virtual, Bursa -- 197135
dc.description.abstractIn this study, an antenna design is presented for the Internet of things applications that need directional antennas. The antenna design includes a multilayer I-slot microstrip patch antenna and two copper director rod elements. The multilayer I-slot microstrip patch antenna comprises three different layers. The first and third layers are FR4 materials with a dielectric constant of ?1 = 4.15 and a height of h = 1.6 mm while the second layer consists of PETG material with a dielectric constant of ?2 = 2.62 and a height of h = 4 mm. The copper rods utilized in our design are used to increase the directivity of the antenna and have a diameter of R = 2.7 mm. PETG material used in the antenna design is produced with a 3D printer. The simulations of the designed antenna in this study are carried out by using Comsol Multiphysics software. The proposed antenna produced after the design and the simulation studies. The simulation and measurement results are compared and found compatible. The antenna designed in this study for 2400-2483.5 MHz ISM band applications has a gain of 7.2 dBi and a bandwidth from 2398 MHz to 2554 MHz. © 2023 IEEE.
dc.description.sponsorshipTürkiye Bilimsel ve Teknolojik Araştırma Kurumu, TÜBİTAK, (120E396); Türkiye Bilimsel ve Teknolojik Araştırma Kurumu, TÜBİTAK
dc.identifier.doi10.1109/ELECO60389.2023.10415969
dc.identifier.isbn979-835036049-3
dc.identifier.scopus2-s2.0-85185844153
dc.identifier.scopusqualityN/A
dc.identifier.urihttps://doi.org/10.1109/ELECO60389.2023.10415969
dc.identifier.urihttps://hdl.handle.net/11480/10954
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers Inc.
dc.relation.ispartof14th International Conference on Electrical and Electronics Engineering, ELECO 2023 - Proceedings
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_20241106
dc.subject3D printing
dc.subjectCopper
dc.subjectDielectric materials
dc.subjectInternet of things
dc.subjectMicrostrip antennas
dc.subjectSlot antennas
dc.subjectAntenna design
dc.subjectComsol multiphysics
dc.subjectCopper rod
dc.subjectDifferent layers
dc.subjectDirectional Antenna
dc.subjectMicro-strip patch antennas
dc.subjectMicrostrip-patch antenna
dc.subjectMulti-layers
dc.subjectMultiphysics software
dc.subjectSecond layer
dc.subjectMultilayers
dc.titleMulti-Layer I-Slot Microstrip Antenna for Internet of Things Applications
dc.typeConference Object

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