The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
Küçük Resim Yok
Tarih
2011
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
SPRINGER
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Tin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 K/mm, growth rate (V) = 7 mu m/s and G = 4 K/mm, V = 130 mu m/s) using a Bridgman type directional solidification apparatus. The measurements of microhardness of directionally solidified samples were obtained by using a microhardness test device. The dependence of microhardness HV (Vickers Hardness) on composition was analyzed. According to these results, it has been found that the values of HV increase with the increasing Cu content (C (o) ). Variation of electrical resistivity (rho) and electrical conductivity (sigma) with the temperature were also measured by using a standard d.c. four-point probe technique. The enthalpy of fusion (a dagger H) and specific heat (Cp) of the Sn-Cu alloys were determined from heating curve during the transformation from solid to liquid phase by using differential scanning calorimeter (DSC).
Açıklama
Anahtar Kelimeler
Kaynak
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
WoS Q Değeri
Q2
Scopus Q Değeri
Q2
Cilt
22
Sayı
9
