The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys

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dc.contributor.authorCadirli, E.
dc.contributor.authorKaya, H.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2011
dc.departmentNiğde ÖHÜ
dc.description.abstractTin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 K/mm, growth rate (V) = 7 mu m/s and G = 4 K/mm, V = 130 mu m/s) using a Bridgman type directional solidification apparatus. The measurements of microhardness of directionally solidified samples were obtained by using a microhardness test device. The dependence of microhardness HV (Vickers Hardness) on composition was analyzed. According to these results, it has been found that the values of HV increase with the increasing Cu content (C (o) ). Variation of electrical resistivity (rho) and electrical conductivity (sigma) with the temperature were also measured by using a standard d.c. four-point probe technique. The enthalpy of fusion (a dagger H) and specific heat (Cp) of the Sn-Cu alloys were determined from heating curve during the transformation from solid to liquid phase by using differential scanning calorimeter (DSC).
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [107T095]
dc.description.sponsorshipThis research was supported financially by the Scientific and Technical Research Council of Turkey (TUBITAK) under contract no. 107T095. The authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for their financial supports.
dc.identifier.doi10.1007/s10854-011-0317-x
dc.identifier.endpage1386
dc.identifier.issn0957-4522
dc.identifier.issue9
dc.identifier.scopus2-s2.0-80054970828
dc.identifier.scopusqualityQ2
dc.identifier.startpage1378
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-011-0317-x
dc.identifier.urihttps://hdl.handle.net/11480/4700
dc.identifier.volume22
dc.identifier.wosWOS:000293773500032
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleThe effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
dc.typeArticle

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