Thermal analysis of chip on board packaging of high power led’s with heat pipe using Cfd for street lights

dc.contributor.authorCicek, Burcu
dc.contributor.authorSahin, Necmettin
dc.contributor.authorAlkan, Mahmut
dc.date.accessioned2024-11-07T10:40:09Z
dc.date.available2024-11-07T10:40:09Z
dc.date.issued2018
dc.departmentNiğde Ömer Halisdemir Üniversitesi
dc.description.abstractIn this study, in order to provide heat dissipation of the high power LEDs to be used for street illumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this system was carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis was performed for different numbers, diameters and lengths of heat pipes and optimum values were obtained. Afterwards, the optimum materials to be used as components of LED packages were determined. In addition, the effect of the power applied to the LED chip and of ambient temperature on the temperature distribution of the whole system was examined. © 2018, Gazi University Eti Mahallesi. All rights reserved.
dc.identifier.endpage1244
dc.identifier.issn2147-1762
dc.identifier.issue4
dc.identifier.scopus2-s2.0-85058332217
dc.identifier.scopusqualityQ3
dc.identifier.startpage1229
dc.identifier.trdizinid324180
dc.identifier.urihttps://search.trdizin.gov.tr/tr/yayin/detay/324180
dc.identifier.urihttps://hdl.handle.net/11480/11442
dc.identifier.volume31
dc.indekslendigikaynakScopus
dc.indekslendigikaynakTR-Dizin
dc.language.isoen
dc.publisherGazi Universitesi
dc.relation.ispartofGazi University Journal of Science
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_20241106
dc.subjectCFD
dc.subjectHeat pipe
dc.subjectHigh power led
dc.subjectThermal analysis
dc.titleThermal analysis of chip on board packaging of high power led’s with heat pipe using Cfd for street lights
dc.typeArticle

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