Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy

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dc.authorid0000-0001-8746-8770
dc.authorid0000-0002-6830-8349
dc.contributor.authorCadirli, E.
dc.contributor.authorBoyuk, U.
dc.contributor.authorEngin, S.
dc.contributor.authorKaya, H.
dc.contributor.authorMarasli, N.
dc.contributor.authorAri, M.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2010
dc.departmentNiğde ÖHÜ
dc.description.abstractSn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) at a constant growth rate (7.64 mu m/s) in the Bridgman-type growth apparatus. The measurements of microhardness of directionally solidified samples were obtained by using a microhardness test device. The dependence of microhardness HV on the growth rate (V) and temperature gradient (G) were analyzed. According to these results, it has been found that with the increasing the values of V and G the value of HV increases. Variations of electrical resistivity (rho) and electrical conductivity (sigma) for casting samples with the temperature in the range of 300-500 K were also measured by using a standard dc four-point probe technique. The variation of Lorenz coefficient with the temperature for Sn-3 wt% Cu hypereutectic alloy was determined by using the measured values of electrical and thermal conductivities. The enthalpy of fusion for same alloy was determined by means of differential scanning calorimeter from heating trace during the transformation from eutectic liquid to eutectic solid.
dc.description.sponsorshipScientific and Technical Research Council of Turkey (TUBITAK) [107T095]
dc.description.sponsorshipThis research was supported financially by the Scientific and Technical Research Council of Turkey (TUBITAK) under contract no. 107T095. The authors are grateful to the Scientific and Technical Research Council of Turkey (TUBITAK) for their financial supports.
dc.identifier.doi10.1007/s10854-009-9940-1
dc.identifier.endpage474
dc.identifier.issn0957-4522
dc.identifier.issue5
dc.identifier.scopus2-s2.0-77953321466
dc.identifier.scopusqualityQ2
dc.identifier.startpage468
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-009-9940-1
dc.identifier.urihttps://hdl.handle.net/11480/4887
dc.identifier.volume21
dc.identifier.wosWOS:000276354300007
dc.identifier.wosqualityQ3
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleInvestigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
dc.typeArticle

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