Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
Küçük Resim Yok
Tarih
2011
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
SPRINGER
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Sn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 293-476 K for the directionally solidified Sn-3.5 wt% Ag eutectic alloy was measured. The measurements indicate that the electrical resistivity of the directionally solidified Sn-Ag eutectic solder increases with increasing temperature. The variations of thermal conductivity of solid phases versus temperature for the same alloy was determined from the Wiedemann-Franz and Smith-Palmer equations by using the measured values of electrical conductivity. From the graphs of electrical resistivity and thermal conductivity versus temperature, the temperature coefficient of electrical resistivity (alpha (TCR) ) and the temperature coefficient of thermal conductivity (alpha (TCT) ) for the same alloy were obtained. According to experimental results, the electrical and thermal conductivity of Sn-Ag eutectic solder linearly decrease with increasing the temperature. The enthalpy of fusion (Delta H) and the change of specific heat (Delta C (P) ) during the transformation at the studied alloy were determined from heating curve during the transformation from eutectic solid to eutectic liquid by means of differential scanning calorimeter (DSC).
Açıklama
Anahtar Kelimeler
Kaynak
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
WoS Q Değeri
Q2
Scopus Q Değeri
Q2
Cilt
22
Sayı
11
