Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy

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dc.contributor.authorCadirli, E.
dc.contributor.authorSahin, M.
dc.contributor.authorKayali, R.
dc.contributor.authorAri, M.
dc.contributor.authorDurmus, S.
dc.date.accessioned2019-08-01T13:38:39Z
dc.date.available2019-08-01T13:38:39Z
dc.date.issued2011
dc.departmentNiğde ÖHÜ
dc.description.abstractSn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 293-476 K for the directionally solidified Sn-3.5 wt% Ag eutectic alloy was measured. The measurements indicate that the electrical resistivity of the directionally solidified Sn-Ag eutectic solder increases with increasing temperature. The variations of thermal conductivity of solid phases versus temperature for the same alloy was determined from the Wiedemann-Franz and Smith-Palmer equations by using the measured values of electrical conductivity. From the graphs of electrical resistivity and thermal conductivity versus temperature, the temperature coefficient of electrical resistivity (alpha (TCR) ) and the temperature coefficient of thermal conductivity (alpha (TCT) ) for the same alloy were obtained. According to experimental results, the electrical and thermal conductivity of Sn-Ag eutectic solder linearly decrease with increasing the temperature. The enthalpy of fusion (Delta H) and the change of specific heat (Delta C (P) ) during the transformation at the studied alloy were determined from heating curve during the transformation from eutectic solid to eutectic liquid by means of differential scanning calorimeter (DSC).
dc.description.sponsorshipNigde University Scientific Research Project Unit [FEB 2009/02]
dc.description.sponsorshipThis project was supported by the Nigde University Scientific Research Project Unit under Contract No: FEB 2009/02. Authors would like to thank to the Nigde University Scientific Research Project Unit for their financial support.
dc.identifier.doi10.1007/s10854-011-0350-9
dc.identifier.endpage1714
dc.identifier.issn0957-4522
dc.identifier.issue11
dc.identifier.scopus2-s2.0-80053362084
dc.identifier.scopusqualityQ2
dc.identifier.startpage1709
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-011-0350-9
dc.identifier.urihttps://hdl.handle.net/11480/4679
dc.identifier.volume22
dc.identifier.wosWOS:000295280900013
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthor[0-Belirlenecek]
dc.language.isoen
dc.publisherSPRINGER
dc.relation.ispartofJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.titleDependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
dc.typeArticle

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