Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
Küçük Resim Yok
Tarih
2012
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
ELSEVIER SCIENCE BV
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a constant growth rate (8.30 mu m/s) by using a Bridgman type directional solidification apparatus. The dependence of microhardness (HV) on the growth rate (V), temperature gradient (G) and microstructure parameter (lambda) were found to be HV = k(1) V(0.10), HV = k(2) G(0.13) and HV = k(3) lambda(-0.22), respectively. The electrical resistivity of the Al-Cu-Ag eutectic cast alloy increases linearly with the temperature in the range of 300-780 K. The enthalpy of fusion and specific heat change during melting for same alloy were also determined to be 223.8 J/g, and 0.433 J/g K, respectively by a differential scanning calorimeter from heating curve during the transformation from eutectic solid to eutectic liquid. (C) 2011 Elsevier B. V. All rights reserved.
Açıklama
Anahtar Kelimeler
Ternary alloy, Eutectic, Microhardness, Electrical resistivity, Enthalpy
Kaynak
CURRENT APPLIED PHYSICS
WoS Q Değeri
Q2
Scopus Q Değeri
Q2
Cilt
12
Sayı
1
