Effect of silicon content on microstructure, mechanical and electrical properties of the directionally solidified Al-based quaternary alloys
Küçük Resim Yok
Tarih
2017
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Elsevier Science Sa
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
Effect of silicon content on the microstructure (lamellar and flake), mechanical (microhardness, ultimate tensile strength) and electrical resistivity properties of Al-Cu-Fe-Si quaternary alloys has been investigated. Al-26Cu-0.5Fe-xSi (x = 6.5, 8, 10, 12 and 14 wt %) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified under constant temperature gradient (8.50 Minim) and growth rate (8.25 mu m/s) by using a Bridgman type directional solidification furnace. Eutectic spacing, microhardness, ultimate tensile strength and electrical resistivity were expressed as functions of composition. The dependency of the eutectic spacing, microhardness, tensile strength and electrical resistivity on the composition (Si content) were determined. According to experimental results, the microhardness, ultimate tensile strength and electrical resistivity of the solidified samples increase with increasing the Si content, but decrease eutectic spacing. Variation of electrical resistivity with the temperature in the range of 300-650 K for studied alloys was also measured by using a standard d.c. four point probe technique. (C) 2016 Elsevier B.V. All rights reserved.
Açıklama
Anahtar Kelimeler
Quaternary alloys, Eutectic spacing, Directional solidification, Microhardness, Ultimate tensile strength, Electrical resistivity
Kaynak
Journal of Alloys and Compounds
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
694
